HORVAT, Andrej ;CATTON, Ivan . An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip. Strojniški vestnik - Journal of Mechanical Engineering, [S.l.], v. 48, n.9, p. 482-490, july 2017. ISSN 0039-2480. Available at: <https://www.sv-jme.eu/article/an-analysis-of-conjugate-heat-transfer-in-the-heat-sink-of-an-electronic-chip/>. Date accessed: 20 dec. 2024. doi:http://dx.doi.org/.
Horvat, A., & Catton, I. (2002). An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip. Strojniški vestnik - Journal of Mechanical Engineering, 48(9), 482-490. doi:http://dx.doi.org/
@article{.,
author = {Andrej Horvat and Ivan Catton},
title = {An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip},
journal = {Strojniški vestnik - Journal of Mechanical Engineering},
volume = {48},
number = {9},
year = {2002},
keywords = {heat exchangers; heat sinks; heat transfer; algorithms; },
abstract = {This paper describes the construction of an algorithm for conjugate heat-transfer calculations in order to find the most suitable form for the heat sink of an electronic chip. Applying volume averaging theory (VAT) to a system of transport equations, a heat-sink structure was modeled as a homogeneous porous medium. The geometry of the simulation domain and the boundary conditions followed the experimental setup used in the Morrin-Martinelli-Gier Memorial Heat Transfer Laboratory at the University of California, Los Angeles. The example numerical simulations were performed for the test section with an isothermal structure as well as for the heat-conducting aluminum pin-fins. A comparison of the whole-section drag coefficient Cd as a function of Reynolds number Reh reveals good agreement with existing data, whereas the comparison of the Nusselt number Nu distributions shows larger discrepancies. The finite conductivity of the solid decreases the heat-transfer coefficient and Nusselt number Nu . The influence of conductivity becomes larger with increasing Reynolds number.},
issn = {0039-2480}, pages = {482-490}, doi = {},
url = {https://www.sv-jme.eu/article/an-analysis-of-conjugate-heat-transfer-in-the-heat-sink-of-an-electronic-chip/}
}
Horvat, A.,Catton, I. 2002 July 48. An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip. Strojniški vestnik - Journal of Mechanical Engineering. [Online] 48:9
%A Horvat, Andrej %A Catton, Ivan %D 2002 %T An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip %B 2002 %9 heat exchangers; heat sinks; heat transfer; algorithms; %! An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip %K heat exchangers; heat sinks; heat transfer; algorithms; %X This paper describes the construction of an algorithm for conjugate heat-transfer calculations in order to find the most suitable form for the heat sink of an electronic chip. Applying volume averaging theory (VAT) to a system of transport equations, a heat-sink structure was modeled as a homogeneous porous medium. The geometry of the simulation domain and the boundary conditions followed the experimental setup used in the Morrin-Martinelli-Gier Memorial Heat Transfer Laboratory at the University of California, Los Angeles. The example numerical simulations were performed for the test section with an isothermal structure as well as for the heat-conducting aluminum pin-fins. A comparison of the whole-section drag coefficient Cd as a function of Reynolds number Reh reveals good agreement with existing data, whereas the comparison of the Nusselt number Nu distributions shows larger discrepancies. The finite conductivity of the solid decreases the heat-transfer coefficient and Nusselt number Nu . The influence of conductivity becomes larger with increasing Reynolds number. %U https://www.sv-jme.eu/article/an-analysis-of-conjugate-heat-transfer-in-the-heat-sink-of-an-electronic-chip/ %0 Journal Article %R %& 482 %P 9 %J Strojniški vestnik - Journal of Mechanical Engineering %V 48 %N 9 %@ 0039-2480 %8 2017-07-07 %7 2017-07-07
Horvat, Andrej, & Ivan Catton. "An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip." Strojniški vestnik - Journal of Mechanical Engineering [Online], 48.9 (2002): 482-490. Web. 20 Dec. 2024
TY - JOUR AU - Horvat, Andrej AU - Catton, Ivan PY - 2002 TI - An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip JF - Strojniški vestnik - Journal of Mechanical Engineering DO - KW - heat exchangers; heat sinks; heat transfer; algorithms; N2 - This paper describes the construction of an algorithm for conjugate heat-transfer calculations in order to find the most suitable form for the heat sink of an electronic chip. Applying volume averaging theory (VAT) to a system of transport equations, a heat-sink structure was modeled as a homogeneous porous medium. The geometry of the simulation domain and the boundary conditions followed the experimental setup used in the Morrin-Martinelli-Gier Memorial Heat Transfer Laboratory at the University of California, Los Angeles. The example numerical simulations were performed for the test section with an isothermal structure as well as for the heat-conducting aluminum pin-fins. A comparison of the whole-section drag coefficient Cd as a function of Reynolds number Reh reveals good agreement with existing data, whereas the comparison of the Nusselt number Nu distributions shows larger discrepancies. The finite conductivity of the solid decreases the heat-transfer coefficient and Nusselt number Nu . The influence of conductivity becomes larger with increasing Reynolds number. UR - https://www.sv-jme.eu/article/an-analysis-of-conjugate-heat-transfer-in-the-heat-sink-of-an-electronic-chip/
@article{{}{.},
author = {Horvat, A., Catton, I.},
title = {An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip},
journal = {Strojniški vestnik - Journal of Mechanical Engineering},
volume = {48},
number = {9},
year = {2002},
doi = {},
url = {https://www.sv-jme.eu/article/an-analysis-of-conjugate-heat-transfer-in-the-heat-sink-of-an-electronic-chip/}
}
TY - JOUR AU - Horvat, Andrej AU - Catton, Ivan PY - 2017/07/07 TI - An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip JF - Strojniški vestnik - Journal of Mechanical Engineering; Vol 48, No 9 (2002): Strojniški vestnik - Journal of Mechanical Engineering DO - KW - heat exchangers, heat sinks, heat transfer, algorithms, N2 - This paper describes the construction of an algorithm for conjugate heat-transfer calculations in order to find the most suitable form for the heat sink of an electronic chip. Applying volume averaging theory (VAT) to a system of transport equations, a heat-sink structure was modeled as a homogeneous porous medium. The geometry of the simulation domain and the boundary conditions followed the experimental setup used in the Morrin-Martinelli-Gier Memorial Heat Transfer Laboratory at the University of California, Los Angeles. The example numerical simulations were performed for the test section with an isothermal structure as well as for the heat-conducting aluminum pin-fins. A comparison of the whole-section drag coefficient Cd as a function of Reynolds number Reh reveals good agreement with existing data, whereas the comparison of the Nusselt number Nu distributions shows larger discrepancies. The finite conductivity of the solid decreases the heat-transfer coefficient and Nusselt number Nu . The influence of conductivity becomes larger with increasing Reynolds number. UR - https://www.sv-jme.eu/article/an-analysis-of-conjugate-heat-transfer-in-the-heat-sink-of-an-electronic-chip/
Horvat, Andrej, AND Catton, Ivan. "An Analysis of Conjugate Heat Transfer in the Heat Sink of an Electronic Chip" Strojniški vestnik - Journal of Mechanical Engineering [Online], Volume 48 Number 9 (07 July 2017)
Strojniški vestnik - Journal of Mechanical Engineering 48(2002)9, 482-490
© The Authors, CC-BY 4.0 Int. Change in copyright policy from 2022, Jan 1st.
This paper describes the construction of an algorithm for conjugate heat-transfer calculations in order to find the most suitable form for the heat sink of an electronic chip. Applying volume averaging theory (VAT) to a system of transport equations, a heat-sink structure was modeled as a homogeneous porous medium. The geometry of the simulation domain and the boundary conditions followed the experimental setup used in the Morrin-Martinelli-Gier Memorial Heat Transfer Laboratory at the University of California, Los Angeles. The example numerical simulations were performed for the test section with an isothermal structure as well as for the heat-conducting aluminum pin-fins. A comparison of the whole-section drag coefficient Cd as a function of Reynolds number Reh reveals good agreement with existing data, whereas the comparison of the Nusselt number Nu distributions shows larger discrepancies. The finite conductivity of the solid decreases the heat-transfer coefficient and Nusselt number Nu . The influence of conductivity becomes larger with increasing Reynolds number.